Intel’s 12-Core Skylake-X HEDT chip to launch on May 30

Intel Core i9 benchmarks - 12-Core Skylake-X

Rumors about Intel’s 12-core Skylake-X CPU have been making rounds for a few weeks. Yesterday, the generally reliable BenchLife.info confirmed its existence, as well as revealed the launch date for the new HEDT chip.

The 12-Core Skylake-X chip is Intel’s response to AMD’s 16-Core Ryzen

Reportedly, Intel is set to launch its 12-core Skylake-X part on 30th of May at Computex 2017. Chipzilla’s move to introduce a 12-core SKU can be seen as a reaction to the threat of AMD’s bigger and faster Ryzen processor with even more cores inbound.

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Intel 12-Core Skylake-X under Basin Falls X-Series

The team red is said to be working on a high-end desktop (HEDT) platform built on a new X399 chipset. The platform features a consumer-oriented 16-core Ryzen CPU that would actually be a cut-down version of Naples-based server SP3 socket.

The $180W Zen based processor may run at 3.1GHz base and 3.6GHz boost clocks. Which is equivalent to the performance delivered by two Ryzen 7 1700 chips.

There is nothing official about this 16C/32T Ryzen yet, but if such a thing does happen, it could turn the tables on Intel. Not only has the flexible Zen architecture the capability to match Intel’s levels of performance per core, but it also offers a disruptive value proposition in the mainstream market.

So Intel will have to launch their new 12-core Skylake-X chip with a price cut in order to be competitive against AMD in the x86 battleground. The chip will be unveiled under the Basin Falls X299 platform, with mass availability scheduled for June 26.

Intel Basin Falls X-Series Includes 5 SKUs – Launch at Computex 2017

The Basin Falls will be shipping with 5 SKUs from Skylake-X and Kaby Lake-X families. These include 12-, 10-, 8- and 6-core models based on the Skylake architecture, and a quad-core processor based on the Kaby Lake architecture.

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Intel Basin Falls X299-series Platform

All Skylake-X chips, possibly excluding the 12-core die, have a TDP of 140W while the Kaby Lake-X chip is rated at 112W. The Basin Falls-based products will be branded as the Core i7-7000 series and utilize the LGA 2066 socket, called Socket R4.

Moreover, SKL-X will feature up to 44 lanes of PCIe 3.0 with support for quad-channel DDR4 memory. KBL-X on the other hand will only support dual channel RAM and up to 16 lanes of PCIe 3.0.

The Basin Falls X-Series platform will be unveiled at Computex 2017 in Taipei during May 30 to June 3, with the official release at the end of the month.