Intel Coffee Lake-S Lineup Leaked – 4 & 6-core CPUs using Socket 1151
Intel’s product roadmap slides have leaked in the wild revealing new information about their 8th generation Coffee Lake-S desktop processors. The slides detail the Coffee Lake-S lineup, which will introduce the company’s first six-core mainstream processor models.
The leak comes via a Chinese language website PCEva, according to which Coffee Lake-S lineup includes two Core i7 chips, two Core i5 chips, and a single Core i3 SKU. The Core i3 model will be the only one of the bunch to sport less than six physical cores: it’s a quad-core part with Hyper-Threading support.
|i7-8700K||6 / 12||3.7GHz||4.7GHz||4.6GHz||4.4GHz||4.3GHz||95 watts|
|i7-8700||6 / 12||3.2GHz||4.6GHz||4.5GHz||4.3GHz||4.3GHz||65 watts|
|i5-8600K||6 / 6||3.6GHz||4.3GHz||4.2GHz||4.2GHz||4.1GHz||95 watts|
|i5-8600||6 / 6||2.8GHz||4.0GHz||3.9GHz||3.9GHz||3.8GHz||65 watts|
|i3-8300||4 / 8||4.0GHz||?||?||?||?||65 watts|
The two Coffee Lake Core i7 chips will also support the Hyper-Threading technology, but the Core i5 will have it disabled. Furthermore, the K-series desktop chips will be rated at 95W while others have a TDP of 65W. The slides also reveal that the Coffee Lake-S processors will use the same LGA 1151 socket as the 7th-gen Kaby Lake family.
Intel Coffee Lake-S will roll out with a new 300-series motherboard chipset. The color coding of the platform chipset appears to confirm the previous statement from ASRock saying the new CPUs won’t be backwards compatible with 200-series chipsets. If that is indeed the case, then the use of Socket 1151 doesn’t make any sense.
According to the roadmap slides, Intel Coffee Lake-S platform will feature integrated USB 3.1 Gen 2 (10Gbps) and Turbo Boost Technology 2.0. It will also support Intel’s next-gen Optane memory, Thunderbolt 3 with DisplayPort 1.4, enhanced memory overclocking, DDR4-2666 memory, and up to 24 PCI-E lanes.
Other highlights include:
- Intel Wireless-AC support (802.11ac R2 and Bluetooth 5)
- Up to 30 chipset high-speed I/O lanes
- 10 USB 3.1 ports with up to 6 USB 3.1 Gen 2 (10Gbps) ports
- Up to 6 SATA 6Gbps ports
- Intel Rapid Storage Technology 16
- PCIe 3.0 x4 storage support
- CPU attached Intel PCIe storage
Intel will release Coffee Lake in several variants. For instance, Coffee Lake-X would include high-end chips targeting the enthusiast market.
The “H” group series processors will cater to the needs of laptops requiring high-performance graphics, while the “U” chips will power thin and light notebooks. There will also be “Y” chips designed for extreme low-power tablets and 2-in-1 detachables.
Intel Coffee Lake will be based on the same architecture as the existing Kaby Lake chips, although they will utilize a more optimized 14nm++ process node.
The 8th-gen chips are expected to offer at least 15% increase in performance over the current generation. The chips will rival AMD’s Ryzen processor lineup both in terms of performance and price.
Intel’s leaked roadmap indicates that the first processors in the Coffee Lake-S lineup will launch at the tail end of the third quarter of 2017, which is like right now. The remaining desktop chips will launch in the first quarter of 2018 consisting of dual-core “K” units with 95W TDP, and other units that only require 35W of power.